CROSSLINKED FLUOROPOLYMER CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND METHODS OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 8, 2015
filing date -
Apr 10, 2014
priority date (Note) -
Abandoned
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Abstract
Circuit subassemblies comprising a conductive layer disposed on a dielectric substrate layer, wherein the dielectric substrate layer comprises a crosslinked fluoropolymer.
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