SEMICONDUCTOR DEVICE USING PAPER AS A SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 15, 2015
app pub date -
Nov 22, 2013
filing date -
Nov 22, 2012
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Disclosed are a semiconductor device manufactured using a paper as a substrate and a method of manufacturing the same. According to an embodiment of the present invention, the semiconductor device is manufactured by using a paper including pulp as a raw material or paper as a substrate coated with a heat-resistant material such as silicon. According to the present invention, a metal wiring layer such as a gate electrode is formed on the paper substrate by using a vacuum deposition method, or the like and an insulating layer is stacked thereon.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully