CHIP PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Mar 20, 2015
filing date -
Apr 10, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A chip packaging structure includes an encapsulating material, plurality of first leads, plurality of second leads, a first chip, a second chip and an adhesion layer. The encapsulating material has a top package surface and a corresponding bottom package surface. Each first lead has a first inner lead portion and a first outer lead portion. The first chip is located on the first inner lead portion and electrically coupled to the first leads. Each second lead has a second inner lead portion and a second outer lead portion. The second chip is located on the second inner lead portion and electrically coupled to the second leads. The adhesion layer is located between the first leads and second leads so that the first leads and second leads are connected to each other.
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