METHOD FOR DRYING WAFER SUBSTRATES AND WAFER HOLDER FOR CONDUCTION OF THE METHOD
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 2, 2015
filing date -
Apr 15, 2014
priority date (Note) -
Abandoned
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Abstract
A method for drying wafer substrates immersed into a liquid, and wafer holder for conduction of the method. The method involves holding substrates on a wedge-shaped edge of an elongated wafer holder, the substrates being upright on the wafer holder; transferring the substrates and the wedge-shaped edge of the wafer holder from the liquid to a gas space with a vapor which does not condense on the substrates and which lowers surface tension of liquid residues adhering to the substrates, wherein the removal of liquid residues between the wafer substrates and the wafer holder through a slot in the middle of the wedge-shaped edge of the wafer holder.
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