Substrate Treating Apparatus, Substrate Treating Method, and Recording Medium
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Dec 4, 2014
filing date -
Apr 10, 2014
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Abstract
Provided is a substrate treating apparatus. The substrate treating apparatus includes a module controller receiving the data measured by a sensing unit, an equipment control unit receiving the data from the module controller, and a processing unit receiving the data from the equipment control unit and processing the data, wherein the processing unit calculates latency by using a first time, which is a time when the module controller receives the data from the sensor unit, and a second time, which is a time when the equipment control unit transmits the data to the processing unit.
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