FILM THICKNESS MEASUREMENT DEVICE AND METHOD
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 14, 2015
filing date -
Apr 14, 2014
priority date (Note) -
Abandoned
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Abstract
To measure an inclination of a sample caused due to the warping of the sample, a film thickness measurement device includes: a light projection ellipsometric head for radiating polarized measuring light on a sample; a light reception ellipsometric head for receiving reflected light of the polarized measuring light, to thereby acquire a polarization state of the reflected light; a microscope camera for measuring a height of a surface of the sample at each of a plurality of measurement positions; and a control portion for calculating an inclination on the surface of the sample based on the height measured at the each of the plurality of measurement positions, and calculating a thickness of a film formed on the surface of the sample based on the calculated inclination on the surface of the sample and the polarization state of the reflected light.
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