High purity refractory metal powders and their use in sputtering targets which may have random texture
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United States of America Patent
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Jul 17, 2018
Grant Date -
Oct 15, 2015
app pub date -
Apr 8, 2015
filing date -
Apr 11, 2014
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Abstract
A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.
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