STABILIZED MOULDING COMPOUNDS CONSISTING OF POLYAMIDE AND ASA-COPOLYMERS
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Sep 3, 2012
filing date -
Sep 29, 2011
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Abandoned
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Abstract
Thermoplastic molding compositions comprising:
- a) 3 to 91.8 wt % of at least one polyamide, as component A,b) 3 to 91.8 wt % of one or more styrene copolymers B without any maleic anhydride-derived units,c) 3 to 91.8 wt % of one or more impact-modifying grafted rubbers C,d) 0.2 to 1.5 wt % of a compound of formula (I), as component D:
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