SECURE CARD CUSTOMISABLE BY THERMAL TRANSFER PRINTING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 15, 2015
app pub date -
Oct 31, 2013
filing date -
Oct 31, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A structure that is customizable by thermal transfer printing, in particular D2T2 or re-transfer, in particular for a multi-layer secure card structure, may include a layer of a non-opaque material for receiving thermal transfer printing, preferably comprising a vinyl polymer, in particular non-halogenated, better still a polyvinyl ester, and more preferably still polyvinyl acetate (PVAc); and a fibrous paper sub-layer, comprising at least one security element incorporated into the paper and/or arranged on the surface of the fibrous sub-layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully