Heat Dissipation Assemblies
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United States of America Patent
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Issued Date -
Oct 15, 2015
app pub date -
Apr 15, 2014
filing date -
Apr 15, 2014
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Abstract
A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first portion defines a surface that defines a plurality of spaced apart voids that extend into the first portion. The second portion has an outside surface that complements the surface of the first portion. The second portion is capable of repeated mate and de-mate cycles from the first portion. A gel is disposed on the interior surface of the cavity. In operation, insertion of the second portion within the cavity causes a portion of the gel to displace into openings at first ends of the voids. The gel returns to an original shape when the second portion is removed from the cavity.
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