PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHOD
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United States of America Patent
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N/A
Issued Date -
Oct 8, 2015
app pub date -
Oct 29, 2013
filing date -
Dec 14, 2012
priority date (Note) -
Abandoned
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Abstract
This method includes the steps of forming a second resin layer (4) covering a conductor circuit (3) on a first resin layer (2), forming a water-repellent protective layer (8) on the surface (4a) of the second resin layer (4), cutting a via hole (5) and a trench (6) through/in the second resin layer (4) via a through hole (9) of the protective layer (8), applying a catalyst (10) to the second resin layer (4) to allow the catalyst (10) to adhere to the via hole (5) and the trench (6), stripping the protective layer (8) formed on the surface (4a) of the second resin layer 4, and filling the via hole (5) and the trench (6), to each of which the catalyst (10) has adhered, with a plating metal by electroless plating.
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