CHEMICAL MECHANICAL POLISHING CONDITIONER HAVING DIFFERENT HEIGHTS
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United States of America Patent
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Issued Date -
Oct 8, 2015
app pub date -
Apr 2, 2015
filing date -
Apr 8, 2014
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a chemical mechanical polishing conditioner having different heights, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer. Each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips. The abrasive units have a first tip height and a second tip height. The first tip height is different from the second tip height. The chemical mechanical polishing conditioner can adjust the surface roughness of the pad to be polished and improve the drainage of abrasive slurry.
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