CHEMICAL MECHANICAL POLISHING CONDITIONER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 8, 2015
app pub date -
Apr 2, 2015
filing date -
Apr 8, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a chemical mechanical polishing conditioner, comprising: a substrate; a binding layer disposed on the substrate; and multiple abrasive units placed on the binding layer; wherein each abrasive unit has an abrasive unit substrate and an abrasive layer which is a diamond film formed by chemical vapor deposition and has multiple abrasive tips; wherein the abrasive units have uniform heights, such that the abrasive units form a planarized surface. Therefore, the present invention can improve planarization of the conditioner, enhance efficiency, and prolong lifetime.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully