SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 1, 2015
app pub date -
Mar 9, 2015
filing date -
Mar 31, 2014
priority date (Note) -
Abandoned
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Abstract
A semiconductor package and manufacturing method thereof are disclosed. The semiconductor package includes a photosensitive conductive layer, a chip and an encapsulant. The photosensitive conductive layer includes at least one electrically conductive portion and at least one insulating portion. The chip is disposed on the photosensitive conduct layer and electrically coupled the least one electrically conductive portion. The encapsulant covers the chip and the photosensitive conductive layer.
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