APPARATUS AND METHOD FOR DETACHING CHIP
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United States of America Patent
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Issued Date -
Oct 1, 2015
app pub date -
Mar 27, 2015
filing date -
Apr 1, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are an apparatus and method for detaching a chip, in which a semiconductor chip attached to a tape is detached so as to supply and mount the semiconductor chip on a package or a circuit board. Accordingly, a semiconductor chip may be effectively detached from a tape while minimizing an impact transferred to the semiconductor chip.
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