HOT-CURING EPOXY RESIN COMPOSITIONS THAT CAN BE USED AS BODYSHELL ADHESIVE OR STRUCTURAL FOAM
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United States of America Patent
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app pub date -
Jun 17, 2015
filing date -
Oct 31, 2008
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Abstract
A hot-curing epoxy resin composition including: at least one liquid epoxy resin having an average of more than one epoxy group per molecule; at least one solid epoxy resin having an average of more than one epoxy group per molecule; at least one polymeric impact modifier comprising a functionalized, epoxy-terminated, acrylonitrile/butadiene copolymer; at least one homopolymer, solid at room temperature, of an olefinically unsaturated monomer; and at least one epoxy-resin hardener which is activated via an elevated temperature, with a proportion by weight of the polymeric impact modifier, based on the epoxy resin composition, being smaller than 20% by weight, and an amount by weight of the homopolymer, solid at room temperature, being greater than the amount by weight of the polymeric impact modifier.
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