POLISHING PAD AND METHOD FOR PRODUCING SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150273653A1
SERIAL NO

14439195

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the present invention is to provide a polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption though it has high water absorption property and which hardly causes scratches on the surface to be polished of an object to be polished, and a method for producing the same. A polishing pad having a polishing layer comprising a polyurethane foam having fine cells, wherein the polyurethane foam includes a reaction cured body of a polyurethane raw material composition containing (1) an isocyanate-terminated prepolymer (A) obtained by reacting a prepolymer raw material composition (A′) containing an isocyanate monomer, a high molecular weight polyol (a) and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) obtained by reacting a prepolymer raw material composition (B′) containing a polymerized diisocyanate and a high molecular weight polyol (b), and (3) a chain extender; and the polymerized diisocyanate contains pentamers or higher oligomers in an amount of 40% by weight or less.

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Patent Owner(s)

Patent OwnerAddress
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakai, Yoshiyuki Osaka, JP 56 720

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