INTEGRATED CIRCUIT
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United States of America Patent
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Issued Date -
Sep 24, 2015
app pub date -
May 12, 2014
filing date -
Mar 24, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit (IC) is provided. The IC includes a chip/die and a package. The chip/die includes a first bonding pad, a second bonding pad, a core circuit and a resistance unit. The first bonding pad is coupled to a signal path of the core circuit. The two ends of the resistance unit are respectively coupled to the first bonding pad and the second bonding pad. The package includes a pin and a low-pass circuit. The pin is electrically connected to the first bonding pad. The low-pass circuit is electrically connected to the second bonding pad.
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