ETCHING APPARATUS
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United States of America Patent
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Issued Date -
Sep 24, 2015
app pub date -
Feb 20, 2015
filing date -
Mar 20, 2014
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Abandoned
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Abstract
An etching apparatus including a processing chamber, a supply unit for reactive species, and a lamp for vacuum-ultraviolet light irradiation is prepared. In the etching apparatus, etching can be performed by repeating a first step of adsorbing the reactive species to a surface of a wafer to form byproducts, a second step of irradiating the surface of the wafer with vacuum-ultraviolet light from the lamp for vacuum-ultraviolet light irradiation, to desorb the byproducts, and a third step of exhausting the desorbed byproducts.
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