CIRCUIT MOUNTING APPARATUS AND METHOD USING A SEGMENTED LEAD-FRAME

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United States of America Patent

APP PUB NO 20150268261A1
SERIAL NO

14217874

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A circuit mounting assembly having a segmented lead frame, and an integrated circuit mounted on the segmented lead frame. The segmented lead frame has a main body portion with at least one severable slot and a plurality of connectors extending from the main body portion. Electrical communication between the plurality of connectors and the integrated circuit is controlled by severance of the at least one slot.

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Patent Owner(s)

Patent OwnerAddress
TRW AUTOMOTIVE U S LLC24175 RESEARCH DRIVE FARMINGTON HILLS MI 48335

International Classification(s)

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  • 2014 Application Filing Year
  • H01L Class
  • 23828 Applications Filed
  • 21803 Patents Issued To-Date
  • 91.51 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murray,, JR Neil Gordon Wixom, US 4 54
Ramsay, Mark Livonia, US 6 26

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Patent Citation Ranking

  • 6 Citation Count
  • H01L Class
  • 10.46 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1377800619237183722181459473474314501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500

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