TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME
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Sep 24, 2015
app pub date -
Mar 18, 2015
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Mar 18, 2014
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Abstract
A tin or tin alloy electroplating bath and a process for producing a bump using the same are disclosed. The electroplating bath includes an inorganic acid and an organic acid, as well as a water-soluble salt thereof; a non-ionic surfactant selected from the group consisting of polyoxyalkylene phenyl ethers, polyoxyalkylene polycyclic phenyl ethers, and salts thereof; and leveling agents containing at least one selected from the group consisting of aliphatic aldehydes, aromatic aldehydes, aliphatic ketones, and aromatic ketones; and at least one selected from the group consisting of α,β-unsaturated carboxylic acids, α,β-unsaturated carboxylic acid amides, and salts thereof. The process includes forming a coating film of a tin or tin alloy on a substrate with an electroplating bath as set forth above; and then performing reflow treatment.
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