ANTENNA
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 17, 2015
app pub date -
Mar 12, 2014
filing date -
Mar 12, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An antenna comprising: a folded dipole and a reflector positioned to reflect radiation emitted by the dipole that is incident on the reflector.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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QUALCOMM TECHNOLOGIES INTERNATIONAL LTD | CHURCHILL HOUSE CAMBRIDGE BUSINESS PARK COWLEY ROAD CAMBRIDGE CB4 0WZ |
International Classification(s)

- 2014 Application Filing Year
- H01Q Class
- 1923 Applications Filed
- 1785 Patents Issued To-Date
- 92.83 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Smith, Leslie David | Ely Cambridgeshire, GB | 5 | 85 |
# of filed Patents : 5 Total Citations : 85 |
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- 0 Citation Count
- H01Q Class
- 0 % this patent is cited more than
- 10 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 17, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent Application No: 2017/0125,179
ARC-ABLATION RESISTANT SWITCH CONTACT AND PREPARATION METHOD THEREOF
Abstract
An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.
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