ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 17, 2015
app pub date -
May 29, 2014
filing date -
Mar 17, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully