METHOD AND APPARATUS FOR BONDING A SEMICONDUCTOR DEVICE OR COMPONENT TO A SUBSTRATE
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Mar 15, 2014
filing date -
Mar 15, 2014
priority date (Note) -
Abandoned
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Abstract
An apparatus for bonding a semiconductor device or component such as a chip to a substrate comprises a heating device having a die where said die has a heating surface adapted to make thermal contact with an upper surface of said chip when said chip is placed with its lower surface over a substrate with a predetermined number of solder humps sandwiched between said lower surface and said substrate. The die is configured to heat the chip to cause the solder bumps to reflow. Once the reflowed solder bumps are set, the solder joint so thrilled is back-filled with a thermally setting epoxy paste. The heating surface of the die has a central region which contacts the upper surface of the chip and an outer region which extends beyond a peripheral edge of the upper surface of the chip. The die has a recess in its heating surface spanning said peripheral edge. The outer region of the die heating surface lies in a same or a lower plane than the die heating surface central region. The die comprises a planar heating member.
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