HIGHLY FILLED HIGH THERMAL CONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING SAME, COMPOSITION, COATING LIQUID AND MOLDED ARTICLE
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United States of America Patent
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Sep 17, 2015
app pub date -
Nov 1, 2013
filing date -
Nov 21, 2012
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[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.
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