HOT MELT ADHESIVE COMPOSITIONS THAT INCLUDE PROPYLENE POLYMER AND ETHYLENE COPOLYMER
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Mar 5, 2015
filing date -
Mar 14, 2014
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Disclosed is a hot melt adhesive composition that includes a polymer component that includes a propylene polymer that includes greater than 50 mole % propylene and exhibiting a melt index greater than 150 grams per ten minutes at 190° C., and an ethylene copolymer exhibiting a melt index of at least 200 grams per ten minutes at 190° C. and an acid number of no greater than 2 mg KOH/g, and derived from ethylene and a co-monomer selected from the group consisting of vinyl acetate, alkyl acrylate, alkyl methacrylate, and combinations thereof, from 0% by weight to no greater than 8% by weight amorphous polyalphaolefin, and from 0% by weight to no greater than 25% by weight oil.
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