PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
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United States of America Patent
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N/A
Issued Date -
Sep 10, 2015
app pub date -
Mar 6, 2015
filing date -
Mar 7, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed wiring board includes a core substrate, and a buildup layer formed on the core substrate and including an interlayer resin insulation layer and a conductive layer. The core substrate includes a metal core, a first insulation layer on first surface of the metal core, a first conductive layer on the first insulation layer, a second insulation layer on second surface of the metal core, and a second conductive layer on the second insulation layer, the metal core has a penetrating hole penetrating from the first surface to the second surface and a resin portion filling the penetrating hole, the resin portion includes resin material from the first insulation layer, the core substrate has a through-hole conductor formed in the resin portion through the metal core, the interlayer resin insulation layer has a core material, and the first insulation layer does not have a core material.
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