EXTENDED ROOM TEMPERATURE STORAGE OF EPOXY RESINS
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United States of America Patent
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Issued Date -
Sep 10, 2015
app pub date -
Mar 7, 2014
filing date -
Mar 7, 2014
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Abandoned
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Abstract
Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafuctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl)oxyphenyl]4-aminobenzoate (3-ABOAB, as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
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