MICROPHONE PACKAGE
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United States of America Patent
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N/A
Issued Date -
Sep 3, 2015
app pub date -
Jan 8, 2015
filing date -
Mar 3, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The microphone package includes: a package substrate including a lead frame and an insulating portion; and an acoustic device mounted on the package substrate and having a space formed in a lower surface thereof, wherein the package substrate includes an acoustic space connected to the space of the acoustic device.
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