Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 14, 2017
Issued Date -
N/A
app pub date -
Feb 28, 2014
filing date -
Feb 28, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully