PLASMA PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20150248994A1
SERIAL NO

14463685

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Abstract

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A plasma processing apparatus, comprising a processing chamber within a vacuum chamber, and a sample stage arranged within the processing chamber with a sample to be processed placed on its top surface, wherein plasma is formed in the processing chamber to perform processing of the sample, wherein the sample stage is provided with an electrostatic chuck which is provided with film electrodes to which power for attraction of the sample is supplied, and upper and lower plate-like sintered bodies joined mutually with the electrodes interposed between them from above and below, and the lower sintered body has a dielectric constant higher than that of the upper sintered body.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECHNOLOGIES CORPORATION24-14 NISHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KAWASAKI, Hiromichi Tokyo, JP 16 52
MAKINO, Akitaka Tokyo, JP 42 1252
SATO, Kohei Tokyo, JP 87 1213
TANDOU, Takumi Tokyo, JP 33 1086

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