HIGH-TEMPERATURE SUPERCONDUCTING WIRE MATERIAL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
May 15, 2015
filing date -
Nov 26, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high-temperature superconducting wire material comprising: a pre-superconducting wire material layer formed by forcibly removing a metal substrate from a superconducting wire material formed by including the metal substrate, a buffer layer formed on the upper surface of the metal substrate and a superconducting conductive layer formed on the upper surface of the buffer layer; a silver (Ag) protective layer formed on the lower surface of the pre-superconducting wire material layer; and a copper (Cu) protective layer formed on the lower surface of the Ag protective layer. Since a superconducting wire material is formed by stripping a metal substrate of a second-generation high-temperature superconducting wire material and forming a metal protective layer, advantages include the reduction of a magnetization loss due to the magnetism of the substrate, excellent stability of the wire material, and increases in Je (engineering current density) due to the minimization of the thickness of the superconducting wire material.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully