Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
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United States of America Patent
Stats
-
Mar 21, 2017
Grant Date -
Sep 3, 2015
app pub date -
May 15, 2015
filing date -
Jan 20, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.
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Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 21, 2028 |
