Heat pump apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9863680
SERIAL NO

14431402

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus includes a refrigerant circuit in which a compressor that compresses a refrigerant, an indoor-side heat exchanger serving as a radiator that exchanges heat between the refrigerant and a heating target, an expansion valve that decompresses the refrigerant by opening-degree adjustment, and an outdoor-side heat exchanger serving as an evaporator that exchanges heat between a heat-exchange target and the refrigerant are connected by pipes. The apparatus includes: an outdoor air temperature sensor that detects a temperature of outdoor air serving as the heat-exchange target; a discharge-side temperature sensor that detects a discharge temperature of the refrigerant discharged by the compressor; and a controller that, when the controller determines that a rotation speed of the compressor is a maximum and the temperature of the heat-exchange target is lower than a preset temperature, controls an opening degree of the expansion valve by using the discharge temperature.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Makino, Hiroaki Tokyo, JP 76 487
Nakajima, Komei Tokyo, JP 15 11
Tanaka, Kosuke Tokyo, JP 248 2464
Yamamoto, Kazuhide Tokyo, JP 19 78

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  • 1 Citation Count
  • F25B Class
  • 33.20 % this patent is cited more than
  • 7 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2404522271101 - 1011 - 2021 - 3031 - 4041 - 500255075100125150175200225250275300325350375400425450475

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