METHOD OF CONVEYING HEAT FROM A LIGHT EMITTING DIODE ASSEMBLY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 3, 2015
app pub date -
Sep 27, 2013
filing date -
Sep 28, 2012
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method of conveying heat from a light emitting diode assembly. The method includes providing a light emitting diode assembly having a body that has a substrate with driving circuitry and a plurality of light emitting diodes that produce heat that is conveyed to a heat transfer element. The heat transfer element has a continuously engaged interface with the ceiling of a dwelling when secured. In this manner heat is conveyed from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly, thus presenting a light emitting diode assembly with a low profile.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully