Substrate holder, plating apparatus, and plating method
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United States of America Patent
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Jun 11, 2019
Grant Date -
Sep 3, 2015
app pub date -
Feb 27, 2015
filing date -
Feb 28, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate holder according to the present invention comprises a first power supply member and a second power supply member which allow power to be supplied to substrates having different properties. The first power supply member comprises a first power supply member end part which extends toward the inside of a substrate holding surface and is disposed at a first position of the substrate holding surface. The second power supply member comprises a second power supply member end part which extends toward the inside of the substrate holding surface and is disposed at a second position of the substrate holding surface. The first position is located on the center side of the substrate holding surface relative to the second position.
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