Thin NiB or CoB capping layer for non-noble metallic bonding landing pads

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United States of America Patent

PATENT NO 10066303
APP PUB NO 20150247244A1
SERIAL NO

14634535

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Abstract

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The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble metallic bonding landing pad from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beyne, Eric Leuven, BE 88 2955
De, Vos Joeri Neerwinden, BE 5 68
Derakhshandeh, Jaber Leuven, BE 9 20
England, Luke Saratoga Springs, US 35 540
Vakanas, George Tempe, US 7 64

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