Pre-treatment method of plating, storage medium, and plating system

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United States of America Patent

PATENT NO 9650717
SERIAL NO

14633319

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Abstract

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A pre-treatment method of plating and a plating system can perform a uniform plating process in which sufficient adhesivity on a surface of a substrate is obtained. The pre-treatment method of plating includes a coupling layer forming process of forming a titanium-based coupling layer 21b on the surface of the substrate with a titanium coupling agent; and a coupling layer modification process of modifying a surface of the titanium-based coupling layer 21b with a modifying liquid after the coupling layer forming process.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDAKASAKA BIZ TOWER 3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwai, Kazutoshi Nirasaki, JP 16 9
Iwashita, Mitsuaki Nirasaki, JP 90 1643
Mizutani, Nobutaka Nirasaki, JP 29 33

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