Edge hump reduction faceplate by plasma modulation
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United States of America Patent
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Oct 16, 2018
Grant Date -
Sep 3, 2015
app pub date -
Jan 12, 2015
filing date -
Mar 3, 2014
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Abstract
Embodiments described herein relate to a faceplate for improving film uniformity. A semiconductor processing apparatus includes a pedestal, an edge ring and a faceplate having distinct regions with differing hole densities. The faceplate has an inner region and an outer region which surrounds the inner region. The inner region has a greater density of holes formed therethrough when compared to the outer region. The inner region is sized to correspond with a substrate being processed while the outer region is sized to correspond with the edge ring.
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