FILM DEPOSITION DEVICE
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United States of America Patent
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Issued Date -
Sep 3, 2015
app pub date -
Nov 13, 2013
filing date -
Nov 14, 2012
priority date (Note) -
Abandoned
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Abstract
A film deposition device (1) is provided which forms a film by performing a PVD treatment on a surface of a substrate (W) and can enhance uniformity in thickness of the film. The film deposition device includes a vacuum chamber (2) that accommodates substrates (W), plural evaporation sources that are installed on an inner wall surface of the vacuum chamber, and a substrate support member (3) that causes the substrates (W) to move in the vacuum chamber (2) while supporting the plural substrates (W). The plural evaporation sources are arranged to be parallel to a direction along a table rotation axis and include a first evaporation source which is at least one of the evaporation sources (4a, 4b) located to face both ends of the substrates (W) and second evaporation sources (4b, 4c) adjacent to the inside of the first evaporation source. The first evaporation source is disposed to further protrude toward the substrates (W) than the second evaporation source.
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