Adhesive bonding by polymer chain reconfiguration
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United States of America Patent
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Sep 3, 2015
app pub date -
Feb 27, 2015
filing date -
Feb 28, 2014
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Abstract
A method is described for joining, in particular adhering, plastic to a substrate. To achieve a strong adhesive effect, in a method task a) a plastic material that encompasses at least one thermally reversibly cleavable polymer is furnished, and in a method task b) the plastic material is brought into contact with the substrate, a portion of the plastic material which is brought into contact with the substrate being heated to a temperature at which the at least one thermally reversibly cleavable polymer of the plastic material becomes thermally cleaved, and re-cooling or being re-cooled while in contact with the substrate. Also described is a plastic/substrate composite manufactured thereby, a polymer, and a polymer use for adhering.
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