High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites
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United States of America Patent
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Dec 6, 2016
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Sep 3, 2015
app pub date -
May 14, 2015
filing date -
Jan 25, 2011
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Abstract
A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
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