THERMOSETTING RESIN COMPOSITION AND ITS USAGE
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Sep 3, 2015
app pub date -
Feb 9, 2015
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Mar 3, 2014
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The present invention discloses a thermosetting resin composition, which comprises epoxy resin with 2 or more than 2 epoxy groups in each resin molecule; and active ester containing styrene structure. The thermosetting resin composition is used to prepare resin sheet, resin composite metal copper foil, prepreg, laminate, copper clad laminate, printed circuit board and the like. The thermosetting resin composition significantly reduces the probability of delamination in PCB substrate, and the obtained resin composition has excellent thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and excellent flame retardancy.
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