LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
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United States of America Patent
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app pub date -
May 18, 2015
filing date -
Nov 20, 2012
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Included are a laser light source (10) configured to output pulsed laser light with an intensity peak in a wavelength range from 8 μm to 11 μm and a pulse width of 30 ns or less, an optical system (40) configured to condense the pulsed laser light toward a workpiece (70) and allow the workpiece to be irradiated with the condensed pulsed laser light, and a controller (60) configured to control a repetition frequency of the pulsed laser light that is to be outputted from the laser light source (10) to be 25 kHz or greater. This suppresses thermal diffusion and increases an absorption coefficient of a laser irradiated part of the workpiece (70), and suppresses a formed hole from being in a tapered shape and suppresses formation of uplifting around the hole upon performing of minute drilling.
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