METHOD FOR FORMING THIN FILM

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United States of America Patent

SERIAL NO

14716181

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Abstract

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A method for forming a SiO2 thin film on a glass substrate by an online atmospheric pressure CVD method, which uses, as a raw material gas supply means, a post mixing type raw material supply means of separately supplying a process gas 1 which contains monosilane (SiH4) as a main raw material gas and a process gas 2 which contains oxygen (O2) as an auxiliary raw material gas and mixing the process gases 1 and 2 on the glass substrate, wherein the flow rate of the monosilane (SiH4) per unit width is at least 1.0 NL/min·m, and the process gas 1 contains ethylene (C2H4) in an amount such that the concentration ratio to the monosilane (SiH4) (C2H4 (mol %)/SiH4 (mol %)) is at most 3.2, whereby the deposition rate for forming a SiO2 thin film is improved.

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Patent Owner(s)

Patent OwnerAddress
ASAHI GLASS COMPANY LIMITED5-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8405

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiromatsu, Kuniaki Tokyo, JP 8 66
Nishida, Wataru Tokyo, JP 7 23
Seki, Atsushi Tokyo, JP 39 193

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