Liquid ejecting head and liquid ejecting apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9266327
APP PUB NO 20150246538A1
SERIAL NO

14627845

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Abstract

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A liquid ejecting head includes a pressure chamber forming substrate in which a plurality of spaces to be pressure chambers in communication with nozzles are provided side by side in a nozzle column direction, in which in a region corresponding to the pressure chamber, a lower electrode film is formed with a width of 50% or more and 80% or less of a width of the pressure chamber in the nozzle column direction and the piezoelectric body layer covers the lower electrode film in the nozzle column direction and is formed with a width of 90% or less of the width of the pressure chamber.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO 160-8801

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuzawa, Yuma Matsumoto, JP 65 161
Hirai, Eiju Minowa-machi, JP 144 664
Takabe, Motoki Shiojiri, JP 163 350
Yazaki, Shiro Chino, JP 66 459

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