Wire-bonding apparatus and method of wire bonding
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United States of America Patent
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Oct 4, 2016
Grant Date -
Sep 3, 2015
app pub date -
May 15, 2015
filing date -
Nov 16, 2012
priority date (Note) -
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Abstract
Provided is a wire-bonding apparatus 10 including a capillary 28 through which a wire 30 is inserted, a nonsticking determination circuit 36, and a controller 80. The nonsticking determination circuit 36 applies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target, obtains a capacitance value between the wire held by the capillary and the bonding target, determines that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation, and determines that the disconnected wire drops down and is brought into contact with the bonding target when the capacitance value returns to an original value before reaching the second bonding point.
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