Substrate processing apparatus, and nozzle
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United States of America Patent
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Jan 10, 2017
Grant Date -
Sep 3, 2015
app pub date -
Apr 29, 2015
filing date -
Aug 30, 2011
priority date (Note) -
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Abstract
A substrate processing apparatus includes a substrate holding unit, an injection unit that injects droplets of a processing liquid from a plurality of injection ports respectively toward a plurality of collision positions on the substrate, and a liquid film forming unit. The liquid film forming unit discharges a protective liquid from a plurality of discharge ports toward a plurality of liquid contact positions that respectively cover different collision positions. The plurality of injection ports and the plurality of discharge ports may be formed in a nozzle. A nozzle moving unit may be provided, to move the nozzle along the substrate.
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