CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMBLY USING EMBEDDED NICKEL-METAL COMPOSITE MATERIALS
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United States of America Patent
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Issued Date -
Aug 27, 2015
app pub date -
Feb 26, 2014
filing date -
Feb 26, 2014
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Abstract
A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The PCBA has one or more designated protected areas. An electrical current with a predetermined current density is present in the conductive layer when the PCBA is placed in the electric field. The TCL is constructed of a nickel-metal composite metamaterial positioned between the conductive and dielectric layers. The TCL has a variable geometry with respect to at least one of the thickness, width, and length of the PCBA, and compresses in proportion to an energy level of the electric field to direct the electrical current away from the designated protected area(s). A system includes a housing, a power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing.
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