Stencil assembly structure
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United States of America Patent
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Jun 14, 2016
Grant Date -
Aug 27, 2015
app pub date -
Apr 29, 2015
filing date -
Dec 31, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A stencil assembly structure used for printing solder paste on a printed circuit board includes a stencil, a fixing frame, a deformable tube and a gas supplying device. The stencil includes plural first apertures and plural second apertures. The plural first apertures are collaboratively defined as a solder paste printing region. The fixing frame includes a frame body and plural fixing seats, and each fixing seat has a guide pin. After the plural guide pins are penetrated through the corresponding second apertures of the stencil, the stencil is fixed on the fixing seats. The deformable tube is disposed at bottoms of the fixing seats. The gas supplying device is connected with the deformable tube to adjust gas amount in the deformable tube. Due to deformation of the deformable tube resulted from gas pressure in the deformable tube, the guide pins are moved and a tension of the stencil is adjusted.
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